CMP PAD
KONI-2WK, KONI-3WK series
반도체 소재 중 가장 기술적 완성도를 요구하는 CMP PAD를 고객의 NEEDS에 부합되게 공급합니다.
: 200mm & 300mm W CMP, OXIDE CMP, Cu CMP
KONI PAD Structure
- Top pad
- PU Elastomer
- micro pore
- Groove (Centric circle, XY)
- Adhesive
- Reactive Hot Melt Adhesive
- Bottom Pad
- PU Foam : compressibility 1~3%
- SP type (Foam on PET film) : compressibility 7~12%
- PSA
- PU Foam : compressibility 1~3%
- SP type (Foam on PET film) : compressibility 7~12%
KONI PAD Feature
KONI PAD Feature – Line up
KONI PAD Feature – Hybrid pore pad
[Physical pore formation system]
Exothermic reaction of polyurethane (150 ℃ ↑)
