CMP Slurry
CMP Polishing Slurry
| Name | Contents | Dilution | PH | Remark |
|---|---|---|---|---|
| A***** 1280 | 12% | RTU | 11.0 | ILD, IMD, STI, BUFFING |
| A***** 2580 | 25% | 1 : 1 | 11.0 | ILD, IMD, STI, BUFFING |
| A***** 3300 | 33% | 1 : 2 | 10.8 | High RR, High diluted & low POU price |
Silicon Wafer Slurry
| Name | Contents | Dilution | PH | Remark |
|---|---|---|---|---|
| WP40* | 20% | 1 : 20 ~ 30 | 11.5 | Stock for Si / Reclaim wafer |
| WP30** | 30% | 1 : 10 ~ 20 | 11.1 | Backside for packaging |
| WP208** | 20% | 1 : 20 ~ 15 | 11.2 | Edge for Si wafer |
| WP2010** | 20% | 1 : 10 ~ 15 | 11.3 | Edge for Si wafer |